Electric or electronic heating device used for Solder melting in order to put together metal pieces, as electronic Device on PC Board.
metal Alloy (lead, tin, silver…) with melting temperature (liquidus) from 160 to 250 °C and more. Standard is Sn63Pb37 at 183°C real eutectic.
Electronic Apparatus included Iron (low voltage) and system of Temperature regulating
Electronic Apparatus included desoldering vacuum Iron with thermal regulation in order to remove an electronical Component by Solder Suction.
SMD or SMC
Surface mounting Device or Component.
REPAIR OR REWORK STATION
Set of soldering and desoldering Station with or without hot Air Generator.
Interchangeable End of the Iron ; generally made of Copper with a special treatment in order to limit effect of Temperature and Lead.
Interchangeable End of desoldering Iron.
Apparatus or Component protected against Electrostatic high Voltage
Ball Grid Array
LEAD FREE SOLDER
New Solder without Lead; to replace with Silver and/or Copper; melting Temperature is about 30°C more than standard Solder. Standard : Sn96.5Ag3.0Cu0.5 at 217°C or Sn96.3Ag3.7 at 221°C real eutectic.